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1.315.428.1200

Wafer Dicing, Die Sorting and Packaging Services.

PACKAGING Services

We offer precision Wire Bonding and Die Bonding services.
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  • Die Mount
  • Goldball Bond or Wedge Bond
  • Goldball bonding (0.0007" to 0.0015" wire)
  • Glob top or epoxy seal
  • Die Sizes From .008" and up
  • Wire pull and ball shear test
  • Die placement accuracy within +/- .001" on all die